Taiwan Semiconductor Manufacturing Co. (TSMC) is exploring a new chip packaging approach to cater to the growing demand in the AI sector. The company is testing rectangular panel-like substrates instead of round wafers, aiming to enhance computing power and accommodate more chips per wafer. Intel and Samsung are also experimenting with similar technology.
$TSM (+1.8% pre) TSMC explores radical new chip packaging approach to feed AI boom - Nikkei https://t.co/DJiaaE14eR
As the AI era evolves and the technology becomes more pervasive, the critical importance of chip manufacturing will be front and center. One area that will be in focus will be advanced packaging, which will be important for delivering greater volumes of the most advanced AI chips… https://t.co/X8bWADPDBc
TSMCis exploring a new method of advanced chip packing as the world’s biggest chipmaker races to keep pace with the AI-fueled demand for computing power. @ChengTingFang @Lauly_Th_Li https://t.co/NZwR4fDubH
TSMC explores radical new chip packaging approach to feed AI boom: use rectangular panel-like substrates, rather than the conventional round wafers used today, allowing more sets of chips to be placed on each wafer, https://t.co/4dzJQuDMoI via @NikkeiAsia
Can TSMC bring a new shape to AI? https://t.co/ib1d0ett2l
🚀 TSMC is revolutionizing chip packaging for the AI era! Stay ahead with the latest tech advancements. Are you ready for the future? 💡🔬 #AI #TechNews @NikkeiAsia https://t.co/aGZXXujMCY
$TSM Said to explore "radical" new AI chip packaging technology using rectangular panel-like substrates rather than round wafers; Rectangular substrates to unlock more power also being tested by Intel, Samsung - Nikkei $NVDA (More at https://t.co/wB88MhC7Uk)
BREAKING: TSMC explores radical new chip packaging approach to feed AI boom. https://t.co/o7x466CdGi