Taiwan Semiconductor Manufacturing Company (TSMC) is reportedly planning to increase prices for its 3nm manufacturing and CoWoS advanced packaging starting in 2024. The price for 3nm chips is expected to rise by over 5%, while the cost of CoWoS advanced packaging will increase by 10%-20%. This decision comes amid a capacity shortage that is anticipated to last through 2026. Major tech companies, including Nvidia, Qualcomm, AMD, Intel, Apple, MediaTek, and Google, are vying for TSMC’s 3nm capacity. The demand for AI accelerators, smartphones, and data centers is driving the strong orders. TSMC also plans to double its CoWoS capacity to 33,000 wafers per month in Q3 from 17,000 in Q2. Additionally, the company aims to double its 3nm capacity.
TSMC $TSM is reportedly planning to hike 3nm prices by 5% and advanced packaging prices by 10% to 20% next year, on strong orders from AI accelerators, smartphones, and data center demand. $NVDA $AMD $AVGO $MRVL
🚀 With major clients like Apple & NVIDIA booking TSMC’s capacity through 2026, it may reportedly raise its 3nm prices by over 5%, while advanced packaging may see a larger degree of price increase! 💡 More details: https://t.co/jhj9PibYYp 🔗
TSMC rises 3.5% in premarket on reports about its considering price hikes for 3nm chips $TSM
📣 JUST IN: $TSM Taiwan Semiconductor to Hike 3nm Chip Prices by Over 5% in 2024 $NVDA $ARM $AMD $INTC $AVGO $MU $SMCI 👉 Key Highlights: 📍 TSM plans to increase 3nm chip prices by over 5%. 📍 Advanced packaging prices to rise by 10-20% in 2024. 📍 N3P mass production set… https://t.co/zeNGURc7JL
Taiwan Semiconductor $TSM is reportedly planning to raise the price of its 3nm chips by over 5% - TrendForce via SeekingAlpha
TAIWAN SEMI $TSM to raise prices for 3nm manufacturing by 5% & CoWoS advanced packaging by 10-20% starting in 2025, due to a capacity shortage that is expected to last thru 2026. Taiwan Semi is also looking to double CoWoS capacity to 33,000 wafers/month & double 3nm capacity to…
$TSM +3% $TSM TSMC is reportedly planning to "RAISE PRICES" for 3nm manufacturing by 5% and CoWoS advanced packaging by 10%-20% starting next year, amid a capacity shortage expected to last through 2026.
CoWoS rammed and the #TSMC price increase is imminent Advanced packaging will rise by about 10%~20% next year, and 3nm foundry will also rise by more than 5%. https://t.co/p3nuo1alot
TSMC is reportedly planning to "RAISE PRICES" for 3nm manufacturing by 5% and CoWoS advanced packaging by 10%-20% starting next year, amid a capacity shortage expected to last through 2026. $TSM CoWoS capacity could double to 33,000 wafers per month in Q3 from 17,000 in Q2.…
Apparently TSMC is raising prices on 3nm and CoWoS.👇🏻 It’s difficult to appreciate the amount of pricing power that TSMC has right now. Given the long tail of AI chip demand TSMC, the pricing for advanced packaging and manufacturing is highly inelastic. And while Samsung is… https://t.co/Y82lkPF9qE
TSMC will raise prices for 3nm manufacturing 5% and CoWoS advanced packaging 10%-20% starting from next year, media report, citing unnamed supply chain sources, amid a shortage of capacity expected to last through 2026. CoWoS capacity is expected to leap to 33,000 wafers/month in…
Taiwan Semi $TSM buyers of 1200 November $175 calls at $17.25 to $17.60 in large lots.. based on these chip flows lately, any corrections into summer will be a gift
$TSM TSMC's 3nm Process Becomes The "Holy Grail" For The Markets: Entire Supply Reserved Until 2026 While Tech Giants NVIDIA, Apple, Qualcomm and AMD Considering Price Hikes CITING TAIWAN ECONOMIC DAILY https://t.co/2jVap29ZGO
$NVDA, $QCOM, $AMD, and others are reportedly considering raising prices for their AI chips due to tight supply of TSMC's 3nm manufacturing tech. Yield issues at Samsung have hampered its 3nm efforts, leaving major players (Intel, Apple, MediaTek, Google) vying for TSMC’s…
Nvidia, Qualcomm, AMD, others are considering raising prices due to the tight supply of TSMC 3nm manufacturing technology for their AI chips, media report, adding 7 major chip designers in all (Intel, Apple, MediaTek, Google) are vying for TSMC’s 3nm capacity. The report says…
$TSM still only goes for 21x NTM EPS in spite of its run-up. And estimates are probably going higher. In addition to all the AI accelerator demand, you've got: 1) An improving demand backdrop for CPUs and mobile SoCs, aided by $AAPL's new AI features (only available on recent…