TSMC has made significant advancements in semiconductor technology, announcing several new developments across various nanometer processes. The company is set to introduce a 1.6nm process technology named A16, featuring backside power delivery that rivals Intel's design. This was unveiled at TSMC's annual North America Technology Symposium. Additionally, TSMC is progressing on the 14 Angstrom (A14) technology aimed at enhancing speed, power, density, and cost, as stated in their 2023 Annual Report. They also plan to launch a cheaper 4nm manufacturing technology (N4C) by 2025, targeting an 8.5% cost reduction. Moreover, TSMC's future plans include the GAAFET N2 technology for 2025, though the N2P variant will lose backside power. The company's advancements also encompass advanced packaging and 3D IC technologies, which are expected to drive the next wave of AI developments.
"The new 1.6nm node process, dubbed A16, was announced at the company's annual North America Technology Symposium." @FacelessManTwit https://t.co/dyG4f4Fh8F
TSMC has announced a breakthrough chip fabrication technology, with reduced node size, increased performance and better power management, all of which should ultimately lead to faster iPhones and Macs By @@MarkozNewz https://t.co/pL5YFXMHiw
TSMC debuts 1.6-nanometer process with new power distribution technology https://t.co/EadMLEwEjI
TSMC Preps Cheaper 4nm N4C Process For 2025, Aiming For 8.5% Cost Reduction https://t.co/smJccRReaN https://t.co/oY7EDA6AOE
TSMC readies lower cost 4nm manufacturing tech: Up to 8.5% cheaper https://t.co/0RjyytVjO2 https://t.co/gWerwYIqRh
TSMC 2nm Update: GAAFET N2 In 2025, N2P Loses Backside Power, and NanoFlex Brings Optimal Cells https://t.co/dx0ldnuzoU https://t.co/OuzX4mFrjI
At the 2024 North America Technology Symposium, #TSMC demonstrated its latest #semiconductor process, advanced packaging, and 3D IC technologies, which will drive the next wave of #AI developments. https://t.co/2rAynPEKVo
TSMC unveils 1.6nm process technology with backside power delivery, rivals Intel's competing design https://t.co/BCWRfFcHgN https://t.co/zmnrTLD39P
TSMC is entering the Angstrom Age with A14 production process “TSMC started development and made good progress on 14 Angstrom (A14) technology, which aims to further improve speed, power, density and cost,” TSMC says in its 2023 Annual Report Thread 1/20 $TSM $ASML $NVDA…