$MU (Micron) is seeing positive analyst sentiment with price target raises by BofA to $170 and Susquehanna to $185. Cantor Fitzgerald also raised the PT to $180, expecting strong earnings in June. Micron plans to start HBM mass production in Taiwan in 2025 to meet AI chip demand.
$MU | BofA Raises Micron PT to $170 from $144, Citing DRAM Upgrades and HBM share gains.
$MU | Cantor Fitzgerald Raises Micron Technology PT to $180 from $150
$MU Micron to start HBM mass production at Taichung OMT in Taiwan in 2025. The factory will handle front-end wafer manufacturing and Through Silicon Via (TSV) to meet the rising demand for HBM in AI chips, according to Taiwanese tech media TechNews.
MICRON $MU price-target raised to $170 (from $144), named 'Top Pick' at Bank of America: "We examine the two most important beneficiaries – compute and memory chips - in the emerging market for AI features on-device, aka Edge AI, that we believe will slowly but steadily…
$MU | Susquehanna Raises Micron PT to $185 from $143 Susquehanna raises estimates across the board and into 3QFY24 earnings due to increased confidence in blended DRAM/NAND pricing trends. However, they remain uncertain on bit shipment upside due to a lack of clean room space,… https://t.co/KKji0gtoFL
Susquehanna Raises $MU PT to $185 from $143 https://t.co/KKji0gtoFL
$MU | Cantor Fitzgerald Raises Micron Technology PT to $180 from $150 Analyst Comments: "Micron earnings is on June 26, where we expect a solid beat and raise. Upside will come from both DRAM and NAND, with HBM likely an upside surprise as well." "Despite recent concerns… https://t.co/tV0qNsZuJs
$MU BofA raised the firm's price target on Micron to $170 from $144 and keeps a Buy rating on the shares
$MU | BofA Raises Micron PT to $170 from $144, Citing DRAM Upgrades and HBM share gains. Analyst Comments: "On-device AI (edge AI) is a growing market promising speed, security, and personalization. Hardware spec upgrades will precede useful AI app adoption, with AI PCs and…
$MU | Samsung Electronics plans to introduce advanced 3D chip packaging this year to meet HBM4 chip demand in 2025. The new technology stacks HBM chips vertically on a GPU, enhancing performance without needing a silicon interposer. The 3D HBM packaging will be offered on a…