Intel has announced a partnership with 14 Japanese companies to develop technology aimed at automating the 'back-end' processes of chipmaking, such as packaging. This initiative, supported by both the U.S. and Japan, is part of a broader effort to reduce geopolitical risks to supply chains, particularly those associated with the concentration of chip packaging in China and Southeast Asia, where Japan firms hold 30% of the market. The collaboration highlights a strategic shift towards enhancing automation in semiconductor manufacturing, with a focus on mitigating supply chain vulnerabilities.
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Intel is partnering with 14 Japan companies to develop new technologies to automate semiconductor packaging (back-end), media report, with a goal to reduce supply chain risk, as most of the world’s chip packaging is concentrated in China and Southeast Asia. Japan firms hold 30%…
Good morning, Asia. This was our most read story while you were sleeping. Intel assembles Japan team for chipmaking automation. https://t.co/m0sDu9vSeF
Intel will partner with 14 Japanese companies to develop technology to automate "back-end" chipmaking processes like packaging as the U.S. and Japan look to cut geopolitical risks to supply chains. https://t.co/SL9POdQQBQ
INTEL ASSEMBLES JAPAN TEAM FOR CHIPMAKING AUTOMATION Intel $INTC will partner with 14 Japanese 🇯🇵 companies to develop technology to automate "back-end" chipmaking processes like packaging - NikkeiAsia https://t.co/jlC2dmU9zZ
$INTC | Intel Assembles Japan Team For Chipmaking Automation - @NikkeiAsia https://t.co/sto16yVknF
INTEL ASSEMBLES JAPAN TEAM FOR CHIPMAKING AUTOMATION - NIKKEI