7 posts • GPT (4o mini)
Updated
More breaking stories on DeepNewz — updated live.
TSMC has nearly finalized specs for a new advanced semiconductor packaging aimed at more powerful AI chips, called ‘panel-level packaging’ that will use a substrate 310mm by 310mm, much smaller than the 515mm-by-515mm previously trialed by TSMC, Nikkei Asia reports, adding a
TSMC is close to finalizing the specifications for a radically new approach to chip packaging to meet demand for more powerful AI chips, with plans to start small volumes of production around 2027, Nikkei Asia has learned. https://t.co/YmXH0mOaWl
$TSM Said to be close to finalizing the specifications for a "radical" new approach to chip packaging for more powerful AI chips, plans to begin small volumes of production around 2027 - Nikkei (TSMC) - Move to 'panel-level' packing on square substrate would impact entire supply https://t.co/tDz5ODYrkd
Sources: TSMC is close to finalizing specs for a new chip packaging method, known in the industry as "panel-level", to meet rising demand for powerful AI chips (@chengtingfang / Nikkei Asia) https://t.co/EZjQ0rzYZV https://t.co/Y4Gzoj0OHQ https://t.co/ZOzeer1FAj
Driving customers straight to Intel’s door. I firmly believe 18A and 14A (and more on the roadmap) will be extremely competitive on the process front and this seems like TSMC is not worried but that seems unwise. https://t.co/lzuioiAmjc
TSMC Poised to Extend Chip Manufacturing Monopoly into Advanced Packaging, Industry Participants Say $005930 $AAPL $AMD $ANSS $GFS $INTC $NVDA $SNPS $SSNLF $TSM https://t.co/bJc6QjEhG8
Driving customers straight to Intel’s door. I firmly believe 18A and 14A (and more on the roadmap) will be extremely competitive on the process front and this seems like TSMC is not worried but that seems unwise. https://t.co/lzuioiAmjc
2D Chip Breakthrough: 6,000 Transistors, 3 Atoms Thick https://t.co/YcOVVTZAbS
