SK Hynix Inc. is set to begin mass production of its next-generation HBM memory chip in the third quarter of this year, aiming to meet the booming demand for AI-related semiconductors. The company's capacity for producing HBM chips is almost fully booked through 2025, with orders for delivery in 2025 nearly sold out and 2024 fully booked. SK Hynix will also start distributing samples of its 12-layer HBM3E chips to customers in May, as reported by Reuters. The anticipated surge in AI memory chip demand is driving this aggressive production schedule.
SK Hynix CEO: HBM memory chips for delivery in 2025 are nearly sold out, while 2024 is fully booked, Reuters reports, adding Hynix will in May begin sending customers samples of its latest chips, 12-layer HBM3E, which will be mass produced from the 3rd quarter. $NVDA $TSM $MU…
SK Hynix foresees long-term surge in AI memory chip demand https://t.co/wbPaCyEUYY
SK Hynix says its capacity to make HBM chips is almost fully booked through 2025 and it now aims to begin mass production of its next-generation HBM chip in Q3 (@yoolimleenews / Bloomberg) https://t.co/IFmeVZCbC0 📫 Subscribe: https://t.co/OyWeKSRpIM https://t.co/AfgLzeToK9
SK Hynix’s AI Memory Chip Orders Almost Fully Booked Till 2025 - BBG https://t.co/5SDR3ZvUj5
SK Hynix Inc. aims to begin mass production of its next-generation memory chip in the third quarter, seeking to capitalize on a surge in demand for the semiconductors essential to AI development. https://t.co/aqzN6d7DXa