Samsung Electronics plans to use chip making technology championed by rival SK Hynix to produce high-bandwidth memory (HBM) chips for AI chipsets. The move aims to improve Samsung's HBM3 yields, currently lower than SK Hynix's. The decision comes as the AI chip race intensifies.
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Times of India @timesofindia: Samsung to use chipmaking tech favoured by SK Hynix as AI chip race heats up: sources. #aistrategy #MachineLearning #aiact https://t.co/HbzpP4Lp6a
Samsung Electronics plans to use a chipmaking technology championed by rival SK Hynix, five people have said, as the world's top memory chipmaker seeks to catch up in the race to produce high-end chips used to power artificial intelligence. https://t.co/mZAih4xTjA
Exclusive: Samsung to use tech favoured by SK Hynix as AI chip making race heats up, sources say https://t.co/NLwLre4qe5 https://t.co/JHNAirbEKX
Samsung has started buying equipment & materials to manufacture HBM memory chips using a technique championed by rival SK Hynix called MR-MUF, Reuters reports, because Samsung’s HBM3 yields are 10-20%, compared to SK Hynix’s 60-70%. The move came after Micron announced an HBM3E…
Exclusive: Samsung to use chip making tech favoured by SK Hynix as AI chip race heats up, sources say https://t.co/ohdFBXBn1S https://t.co/oeoX2fFNL4
SAMSUNG ELEC PLANS TO USE TWO SEPARATE CHIP MAKING METHODS IN PRODUCING LATEST HBM CHIPS, THREE SOURCES SAY
SAMSUNG ELEC PLANS TO ADD 'MUF' CHIP MAKING TECHNOLOGY TO MAKE HBM CHIPS USED IN AI CHIPSETS, FIVE SOURCES SAY