Samsung Electronics is making strategic moves in the semiconductor industry by adopting new chipmaking technologies and adjusting its pricing strategies. The company plans to use two separate chipmaking methods to produce its latest High Bandwidth Memory (HBM) chips, incorporating a technology known as 'MUF' specifically for chips used in AI chipsets. This decision comes as part of Samsung's efforts to improve its competitiveness in the AI chip market, where it seeks to catch up with rivals like SK Hynix. Samsung has initiated talks with material manufacturers, including Japan's Nagase, for the supply of 'MUF' chipmaking materials. Additionally, Samsung is expected to increase NAND flash prices by up to 20% to mitigate losses in its NAND flash business, signaling a renegotiation with major customers for fair pricing, as reported by Chosun Biz. The company has also started purchasing equipment and materials to manufacture HBM memory chips using a technique called MR-MUF, championed by SK Hynix, to improve its HBM3 yields, which currently stand at 10-20%, compared to SK Hynix's 60-70%. This move came after Micron announced an HBM3E, highlighting the competitive dynamics in the industry. Phison's CEO has cautioned that soaring SSD prices could hobble the NAND flash industry with reduced demand.
Samsung Electronics plans to use a chipmaking technology championed by rival SK Hynix, five people have said, as the world's top memory chipmaker seeks to catch up in the race to produce high-end chips used to power artificial intelligence. https://t.co/mZAih4xTjA
Exclusive: Samsung to use tech favoured by SK Hynix as AI chip making race heats up, sources say https://t.co/NLwLre4qe5 https://t.co/JHNAirbEKX
Samsung has started buying equipment & materials to manufacture HBM memory chips using a technique championed by rival SK Hynix called MR-MUF, Reuters reports, because Samsung’s HBM3 yields are 10-20%, compared to SK Hynix’s 60-70%. The move came after Micron announced an HBM3E…
Exclusive: Samsung to use chip making tech favoured by SK Hynix as AI chip race heats up, sources say https://t.co/ohdFBXBn1S https://t.co/oeoX2fFNL4
Samsung is expected to increase NAND flash prices by up to 20%. This indicates that they will pursue renegotiations with major customers to receive fair pricing in order to reduce losses in the NAND flash business. According to Chosun Biz reports, Samsung plans to initiate price…
SAMSUNG ELEC PLANS TO USE TWO SEPARATE CHIP MAKING METHODS IN PRODUCING LATEST HBM CHIPS, THREE SOURCES SAY
SAMSUNG ELEC IN TALKS WITH MATERIAL MANUFACTURERS, INCLUDING JAPAN'S NAGASE, FOR SUPPLY OF 'MUF' CHIP MAKING MATERIALS, SOURCE SAYS
SAMSUNG ELEC PLANS TO ADD 'MUF' CHIP MAKING TECHNOLOGY TO MAKE HBM CHIPS USED IN AI CHIPSETS, FIVE SOURCES SAY
Soaring SSD prices could hobble NAND flash industry with reduced demand, Phison CEO cautions https://t.co/fEbNlEOdGL https://t.co/tWOWVDQzBu