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TSMC $TSM is anticipating revenue from AI server processors will more than double in 2024, accounting for a low-teens percentage of its overall revenue. $NVDA $AMD $AVGO $QCOM
"Compared to the mere 10x increase in tools, TSMC's 30x jump in production underscores how TSMC has been able to increase their EUV productivity, reduce service times, and lower tool downtimes overall" $TSM $ASML https://t.co/OZNZVomPE2 https://t.co/B91V4yTgeO
I can’t help but think TSMC’s advanced packaging capacity being booked out by $AMD and $NVDA is a good thing for Intel. $TSM $INTC https://t.co/i9fOrg2rSG
For our #AI, $TSM is a BUY (AI Score 9/10) based on the probability of beating the market in 3 months after analyzing 10,000 fundamental, technical, and sentiment stock features. Complete AI-powered $TSM analysis: https://t.co/EdbIj2YupV https://t.co/nhoxeUpCrI
In order to meet such demand, TSMC’s $TSM CoWoS capacity is estimated to potentially triple by the end of 2024, from 15,000/month at the end of 2023 to 45,000 to 50,000/month. $NVDA $AMD https://t.co/Nxnur8QYbg
Due to elevated end market demand, it is reported that Nvidia $NVDA and AMD $AMD have fully booked out TSMC’s $TSM advanced packaging capacity through the end of this year and next year.
TSMC’s future generation A16 manufacturing process may not use ASML’s latest High NA EUV lithography machines, media report, citing TSMC Senior VP Kevin Zhang, who said, "I like the technology but I don't like the sticker price." High NA machines are expected to cost over €350…
TSMC $TSM has seen revenue from its most advanced nodes surge thanks to soaring demand for AI GPUs from Nvidia $NVDA and soon AMD $AMD. $AVGO $QCOM $AAPL https://t.co/QBk8IZGZ3V
TSMC says can make next generation chips without ASML's new machine https://t.co/NksXAboDvQ https://t.co/McbBnWr3pb
Taiwan Semiconductor Manufacturing Co. (TSMC) is planning to produce next-generation chips without using ASML's latest machine due to cost concerns. TSMC's revenue from advanced nodes has surged, driven by high demand for AI GPUs from Nvidia and AMD. The company's future A16 manufacturing process may not utilize ASML's High NA EUV lithography machines. Nvidia and AMD have fully booked TSMC's advanced packaging capacity through 2025. TSMC is expected to triple its CoWoS capacity by the end of 2024 to meet demand. TSMC anticipates a significant revenue increase from AI server processors in 2024.