Eliyan, a company specializing in chiplet interconnect technology, has successfully raised $60 million in a Series B funding round. The funding aims to advance its technology that enhances the performance of AI chips. The round was co-led by Samsung Catalyst Fund and Tiger Global, with Intel ($INTC) and Micron ($MU) participating in the first round. Eliyan's technology, which includes the Blackwell NVLink 5.0, achieves 64 Gb/s per bump on a 3nm process and offers die connectivity without the need for a silicon interposer. Currently, it provides 40 Gb/s per bump, competing with TSMC's offerings. Additionally, the company's NuLink PHY technology allows for up to 21 Tb/s per mm with advanced packaging.
Eliyan raises $60M for chiplet interconnects that speed up AI chips https://t.co/NcSVWbxqfS via @VentureBeat
Eliyan, which is developing chiplet interconnects to increase AI chips' performance, raised a $60M Series B co-led by Samsung Catalyst Fund and Tiger Global (@deantak / VentureBeat) https://t.co/hftdkbvwu3 📫 Subscribe: https://t.co/OyWeKSRpIM https://t.co/fwXKWxT590
Eliyan raises $60M for chiplet interconnects that speed up AI chips https://t.co/NcSVWbwSqk via @VentureBeat
Eliyan has raised $60 million in funding for its chiplet interconnect technology that speeds up the processing for AI chips. https://t.co/K6s5a30Ap2
Speaking of Blackwell NVLink 5.0, Samsung and Tiger led Eliyan Series B. $INTC $MU participated in 1st round. 64 Gb/s/bump on 3nm. Die connectivity w/o Si interposer. Eliyan taped out. 40 Gb/s/bump presently from $TSM? NuLink PHY < 100 um pitch. Up to 21 Tb/s/mm w adv package. https://t.co/W5WOkUBThJ